iPhone X-12 Double-stacked Board Separation & Recombination | REWA Academy Tips

Recently, REWA Academy trainees gave comments that both layers usually stop working to fit closely in double-stacked motherboard fixing There are even large voids, creating quasi soldering In action, we will share pointers as well as notes when separating and recombining double-stacked motherboard Peel foam on the motherboard before home heating Please be noted that we do not suggest novices to heat up the motherboard with a hot air gun Since the motherboard may obtain warmth erratically and deform A specialist motherboard heating system is what we suggest To facilitate later on removal of the logic board, drive a screw on the logic board Puncture the tape with a Sculpture Knife The reasoning board as well as center layer are soldered with low-temperature solder paste So the most effective temperature level for the heating platform will be 155 ° C-165 ° C Push the reasoning board delicately with tweezers when the temperature level reaches 165 ° C If the reasoning board hangs, the tin has actually melted Clamp the screw to eliminate the logic board Get rid of the signal board Get rid of thermal oil with a Sculpture Knife Thermal oil need to be gotten rid of entirely Or else, the thermal grease will touch the reasoning board to give rise to pseudo soldering in recombination Attach the signal board to the owner Use a round of Paste Change Eliminate tin on the bonding pad with Blowpipe at 365 ° C as well as Solder Wick Tin on the bonding pad have to be completely gotten rid of The recurring tin will influence the subsequent soldering Clean the bonding pad with PCB Cleaner Clean the logic board with the very same method Please do not damage components around the bonding pad of the logic board while cleansing It is needed to inspect if the bonding pad is cool after cleansing Attach the signal board to the Reballing System Put the reballing pattern ready to make certain that it is pressing against the signal board To avoid the solder paste from flowing into the motherboard gap, insert a steel plate Use a layer of low-temperature Solder Paste Rub out excess solder paste with a Lint-free Wipe Get rid of the reballing stencil Check if solder paste on the signal board is complete While using solder paste, please make sure that solder paste have to have a certain humidity If the solder paste is also completely dry, it will certainly comply with the reballing pattern when the pattern is removed As a result, the solder paste on the signal board will not be consistent, which can quickly result in poor soldering Placed the signal board on the 165 ° C Home heating Platform to warm Quit home heating after the solder balls are created Apply a percentage of Paste Flux after the signal board has actually cooled Align the logic board with the signal board Keep heating on the 165 ° C Heating System When the solder change spills and also logic board sinks, push the logic board gently with tweezers to make sure the 2 layers fit carefully The push should be mild and also tiny Clean the motherboard with PCB Cleanser after the motherboard has actually cooled If you locate the motherboard warped while recombining, you can put the motherboard on a flat board and attach it with an elastic band Press 2 sides of the motherboard carefully To avoid crushing components, please place a soft paper under the motherboard Next, we will certainly share one more recombination method The technique can be taken if the middle bonding pad is not damaged When the tin melts, get rid of the logic board in an upright fashion with tweezers It can be seen that there is a metal pad of 0.05 mm density around the signal board at a particular distance This steel pad is designed to keep a 0.05 mm void in between the logic board as well as the center layer, avoiding the solder balls from bridging while soldering You only require to get rid of thermal grease on the motherboard when the fixing is done Maintain original tin on the bonding pad Use a percentage of Paste Change Finally, line up the reasoning board with the signal board When the temperature gets to 165 ° C and also the tin melts, transform the power off Press two ends of the logic board with tweezers until the motherboard has actually cooled down The logic board as well as the signal board fit closely by doing this There will be no bridging and also solder balls spillover Go to REWA Academy if you want to discover more repair work abilities We have total course plans for motherboard medical diagnosis as well as fixing ability improvement Click the web link in the remark area to acquire motherboard repair work course plans Thank you for watching as well as do not hesitate to leave a remark

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